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KCMC® Base Plate, Copper Base Plate
(Pin Fin / Flat type)
KCMC® Base Plate
Copper Base Plate
Materials : KCMC®, Copper
| No. | Item | Materials | Thermal Expansion [ppm/˚C] | Thermal Conductivity[W/(m.K)]25℃ (Z-direction) |
Process | Plating | |
|---|---|---|---|---|---|---|---|
| 150˚C | 300˚C | ||||||
| 1 | Base Plates (Pin Fin) Base Plates (Flat) |
KCMC®12 | 11.05 | 9.01 | 320 | Stamping, Machining, Brazing, etc. |
Ni Plating |
| KCMC®20 | 9.12 | 7.69 | 291 | ||||
| KCMC®28 | 8.83 | 7.57 | 263 | ||||
| KCMC®33 | 7.83 | 6.96 | 241 | ||||
| KCMC®40 | 7.34 | 6.59 | 222 | ||||
| CPC141 | 8.20 | 7.94 | 227 | ||||
| Copper | 17 | 400 | |||||
Thermal simulation data
- - Simulation results for a power module directly soldered to the base plate(When the temperature varies from 22℃ to 220℃)
Applications
- Power Module
- Automotive, Industrial, Renewable energy, Electric chargers, Data centers, etc.
