KOSTEC presents its high-thermal metal-ceramic packaging platform, developed to meet the increasing thermal management demands of next-generation electronic and optical devices.

With the advancement of high-speed applications such as 1.6T optical transceivers, thermal performance has become a key challenge. Conventional materials with thermal conductivity around 220 W/m·K are no longer sufficient, as rising temperatures can significantly impact device reliability and lifetime.

KOSTEC’s platform incorporates a high thermal conductivity substrate (up to 320 W/m·K) combined with a precision metal housing. This structure enables:

-. Efficient heat dissipation

-. Strong mechanical stability

-. Reliable EMI shielding

In addition, the solution can achieve up to a 20°C reduction in junction temperature, contributing to improved performance and long-term reliability.

This platform is suitable for various applications, including:

-. Optical transceivers and modulators

-. Pump lasers

-. RF power amplifiers

-. Military electronics

-. Co-packaged optics (CPO) substrates

KOSTEC remains committed to providing advanced packaging solutions that support the evolving needs of high-performance semiconductor and photonics industries.